GMT Flat Lapping Machines
GMT Planetary Lapping Machines can lap both sides of a work piece simultaneously. As a consequence work pieces are processed efficiently without manual interruption to get improved parallelism and acts as an surface finishing machine. This double sided lapping machine is an ideal lapping tool for lapping silicon wafers and germanium wafers.
GMT Planetary Lapping Machines can lap both sides of a work piece simultaneously. As a consequence work pieces are processed efficiently without manual interruption to get improved parallelism and acts as an surface finishing machine. This double sided lapping machine is an ideal lapping tool for lapping silicon wafers and germanium wafers.
GMT
planetary lapping machines finds application in electronics, quartz,
ceramics, semiconductor, surgical instruments and optical industries
Workpieces
to be lapped are placed inside the work carriers. The work carriers are
gear cut on the outer diameter and recessed to hold the component
inside. Abrasive fluid is fed onto the lap plates continuously.
The
planetary lapping machines are ideally suited to lap thin, fragile
materials like silicon and germanium wafers extensively used in
electronic industries. Other materials made of tungsten, ceramics,
steel, bronze, carbon, aluminum, cast iron, plastics, stainless steel,
stellite, ferrite and alumina can also be lapped on these machines.
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